SERVICES

PSI offers custom RF solutions over an ultra-wideband (UWB) spectrum from microwave to mmW (300GHz) frequencies. Service includes RF and mmW device modelling, package design and prototyping transmit/receive array solutions.

Capabilities and Services

• UWB phased array antenna
• High-frequency printed circuit board design and layout
• Unique mmW packaging design
• Custom RF design for electro-optic and optic-electric devices
• mmW amplifier and phase shifter design using SiGe technologies

Tools

• Full suite of industry-standard high-frequency electromagnetic simulation analysis and design tools
• Integrated design environment involving RF design, board layout, and packaging design
• Broadband test equipment capable of chip, device, subsystem, and end-to-end system test for rapid prototyping

Previous Custom Work

• Conformal UWB phased array antenna, Photonically driven UWB antenna array, 3D printed mmW antenna, K-band mmW and mmW low noise amplifier packaging design, 40GHz bias-Tee, W-band continually tunable W-band phase shifter

RF testing and measurement of a large variety of devices with operating frequencies ranging from DC to 1Terahertz. PSI has experience measuring amplifiers, splitters/combiners, filters, phase shifters, modulators, photodiodes, and antennas. Our capabilities include manual and automated data collection for fully characterizing performance at multiple bias levels or configurations. Once characterized, these devices have then gone on to be standalone products or as parts of larger systems.

Capabilities and Services

• Support for a variety of connector types such as SMA, 2.92, 2.4, 1.85, 1mm, and a variety of rectangular waveguides
• RF probe testing in GSG and SG configuration from 100 um pitch to 900 um pitch
• Anechoic chamber for far-field free space measurement
• Time domain analysis (TDA)
• Automated collection of insertion loss/gain and input/output reflected power
• Dielectric constant (loss tangent) measurements
• S-parameter measurements up to and beyond 1THz

Tools

• RF link characterization
• Antenna characterization and tuning
• Substrate integrated devices
• Device fault location along signal path using time domain analysis

PSI offers infrastructure with best-in-class equipment for characterizing die-level and packaged PICs. Allow our talented and experienced engineers to help you with any portion of your next PIC measurement and characterization.

Key Capabilities

• Optical characterization of photonic components
• Die-level photonic integrated circuit characterization
• High-frequency analog and RF die-level Characterization
• Probing for electrical and RF die-level characterization

PSI has the required design and modeling software to aid in the support of custom photonic device designs, providing an in-house support to PSI’s photonic device fabrication capabilities.  PSI has 2000+ sqft of cleanroom and conditioned laboratory space dedicated to the fabrication of RF and RF Photonic devices. Consulting services for photonic device design and fabrication are available, in addition to a full design through fabrication service. Design and fabrication services can range from consulting, bare die fabrication or extend to packaged die services, based on your requirements.

Capabilities

• Access to commercially licensed design suites for RF photonic devices, in addition to PSI’s proprietary design toolboxes.
• Microfabrication cleanroom with 1200 sqft of an ISO 6 and ISO 7 class cleanroom with processing equipment capabilities for up to 6” diameter wafers.
• 1000+ sqft of lab space dedicated for mid- to back-end wafer processing, allowing the evaluation, singulation and assembly of RF and photonic dies.
• PSI has performed custom RF photonic device design solutions, supplying bare die modulators, arrayed high-speed phase modulators, custom waveguide and RF Photonic devices.

PSI can offer custom, precision integration & packaging solutions for many different RF, Microwave, Photonic, Fiber-Optic and Optoelectronic modules, components and devices.

Capabilities

• Flip-Chip Bonding
• Wire-Bonding and Ribbon-Bonding
• Pick and Place
• Hermetic Packaging
• Wafer and Chip Dicing
• Environmental Stress Testing
• Vibration-Testing and Thermal-Cycling

PSI has CNC milling capabilities with full three axis machining and 3D simultaneous axis machining. We also have 3D printing systems which can print with hard plastics, elastic plastics and high-strength polymers with option of using water soluble support filament.

CNC Machines

• Mazak V500C
• Hold Extremely Tight Tolerances

3D Printing

• 3NTR A2V4
• Triple Extruders for Multi-Material Prints

Laser Engraving

• RMI Fiber Laser Engraving System