Overview
PSI can offer custom, precision integration & packaging solutions for many different RF, Microwave, Photonic, Fiber-Optic and Optoelectronic modules, components and devices.
Capabilities
- Flip-Chip Bonding
- Wire-Bonding and Ribbon Bonding
- Pick and Place
- Hermetic Packaging
- Wafer and Chip Dicing
- Environmental Stress Testing
- Vibration-Testing and Thermal-Cycling
