Information

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RF and Optical Packaging and Integration

Overview

PSI can offer custom, precision integration & packaging solutions for many different RF, Microwave, Photonic, Fiber-Optic and Optoelectronic modules, components and devices.

Capabilities

  • Flip-Chip Bonding
  • Wire-Bonding and Ribbon Bonding
  • Pick and Place
  • Hermetic Packaging
  • Wafer and Chip Dicing
  • Environmental Stress Testing
  • Vibration-Testing and Thermal-Cycling
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