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Photonic Test and Characterization


PSI offers infrastructure with best-in-class equipment for characterizing die-level and packaged PICs. Allow our talented and experienced engineers to help you with any portion of your next PIC measurement and characterization.

Key Capabilities

  • Optical characterization of photonic components
  • Die-level photonic integrated circuit characterization
  • High frequency analog and RF die-level Characterization
  • Probing for electrical and RF die-level characterization