Overview
PSI can offer custom, (designs?) precision integration & packaging solutions for many different RF, Microwave, Photonic, Fiber-Optic and Optoelectronic modules, components and devices.
Capabilities
Flip-Chip Bonding
- Thermocompression bonding, thermosonic bonding, solder-reflow bonding, epoxy die-bonding
- Chip sizes from 0.020” to 1”
- Data Modulation Module
Wire-Bonding and Ribbon Bonding
- Au-to-Au, Al-to-Au, or Au-to-Al
- Deep Access Capability
- Wire diameters from 0.0007”mil to 0.003”
- Ribbon Thickness from 0.0005”mil to 0.002”; ribbon widths from 0.001” to 0.003”
Pick and Place
- Component and Chip sizes from 2020 to 1”?
Hermetic Packaging
- Welded seam-sealing (Vacuum-environment or inert-gas blanket)
- Epoxy bonding and sealing
- Reflow-soldering, solder-sealing
Wafer and Chip Dicing
- Si, InP, GaAs, Al2O3, SiO2, ALN ceramics
Environmental Stress Testing (small to medium size packages)
- Hot/Cold temperature cycling from +200°C to –150°C (LN2 Cooling Option)
- Voltage-biasing & mechanical or vibration-loading
Vibration-Testing and Thermal-Cycling
- Vibration testing of packages up to 6500 Hz max (Load-dependent); up to 2.2kg (max) loads Pick and Place
- Component and Chip sizes from 2020 to 1”?
