Information

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RF Packaging and Integration

Overview

PSI can offer custom, (designs?) precision integration & packaging solutions for many different RF, Microwave, Photonic, Fiber-Optic and Optoelectronic modules, components and devices.

Capabilities

Flip-Chip Bonding

  • Thermocompression bonding, thermosonic bonding, solder-reflow bonding, epoxy die-bonding
  • Chip sizes from 0.020” to 1”
  • Data Modulation Module

Wire-Bonding and Ribbon Bonding

  • Au-to-Au, Al-to-Au, or Au-to-Al
  • Deep Access Capability
  • Wire diameters from 0.0007”mil to 0.003”
  • Ribbon Thickness from 0.0005”mil to 0.002”; ribbon widths from 0.001” to 0.003”

Pick and Place

  • Component and Chip sizes from 2020 to 1”?

Hermetic Packaging

  • Welded seam-sealing (Vacuum-environment or inert-gas blanket)
  • Epoxy bonding and sealing
  • Reflow-soldering, solder-sealing

Wafer and Chip Dicing

  • Si, InP, GaAs, Al2O3, SiO2, ALN ceramics

Environmental Stress Testing (small to medium size packages)

  • Hot/Cold temperature cycling from +200°C to –150°C (LN2 Cooling Option)
  • Voltage-biasing & mechanical or vibration-loading

Vibration-Testing and Thermal-Cycling

  • Vibration testing of packages up to 6500 Hz max (Load-dependent); up to 2.2kg (max) loads Pick and Place
  • Component and Chip sizes from 2020 to 1”?
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