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SEC Model 865 Eagle, Disco Model DAD3220

SEC 865 Eagle Precision Flip-Chip Bonder
DISCO DAD3220 Dicing Saw
  • SEC Model 865 Eagle: Precision flip-chip bonder capable of thermocompression, thermosonic, or reflow (solder-bump) flip-chip bonding.
  • Disco Model DAD3220: Semiconductor Dicing Saw. Fully programmable, small footprint automatic wafer dicing tool. Maximum wafer size is 150 mm diameter (6”).